Cu-HCP | CW021A Material Datasheet

Material Test Series Values

Material Standard Values

Material Models for Simulation

Unlock Exclusive Materials Data

Gain access to a wealth of materials data by joining our Materials Portal.

Material Description

Material Number	Material Number (single)	Standard	Range of Application	Standard Status	Country	Predecessor	Remark
CW021A (DIN EN 13605 : 2021-07)	CW021A	DIN EN 13605 : 2021-07	Supersedes DIN EN 13605 : 2013-09	Valid	Germany	Cu-HCP	Copper profiles and profiled wire for electrical purposes. Deoxidised coppers of this type are produced with the addition of a controlled amount of deoxidiser, preferably phosphorus, and contain a controlled low amount of residual deoxidiser; these coppers have high electrical conductivity. These coppers may be heat-treated, welded or brazed without the need for special precautions to avoid hydrogen embrittlement.

Chemical Composition

Bi [%]	Cu [%]	P [%]	Pb [%]	Source	Remark
blur	blur	blur	blur	blur	blur

Mechanical Properties

Semi-finished Product	Condition	Strength Abbrevation	Nominal Size [mm]	Temperature [°C]	Tensile Strength [MPa]	Yield Strength (0.2% offset) [MPa]	Elongation A100 [%]	Elongation A [%]	Hardness HB \| HBW	Hardness HV	Source
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur

Physical Properties

Semi-finished Product	Condition	Strength Abbrevation	Nominal Size [mm]	Temperature [°C]	Melting Temperature [°C]	Density [g/cm³]	Young's Modulus [GPa]	Poisson's Ratio	Mean Coefficient of Thermal Expansion [10^-6*K^-1]	Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1]	Thermal Conductivity [W/(m*K)]	Specific Electrical Resistance [µΩm]	Mean Specific Heat Capacity [kJ/(kg*K)]	Electric Conductivity [MS/m]	Specific Mass Resistance [Ωg/m²]	Specific Electric Conductivity [% IACS]	Source	Remark
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur
blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur	blur

Young's Modulus [GPa] vs Temperature [°C]

Exclusive Insight Locked!

This premium diagram is currently blurred. Gain full access to detailed insights and stay ahead with exclusive content.

Unlock Now

Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] vs Temperature [°C]

Exclusive Insight Locked!

This premium diagram is currently blurred. Gain full access to detailed insights and stay ahead with exclusive content.

Unlock Now

Welding and Joining

Procedure	Welding and Joining - Evaluation	Source
blur	blur	blur
blur	blur	blur

Cross Reference

Material Name	Country	Standard	Source
SE-Cu	Germany	DIN 1787	DIN CEN/TS 13388 (DIN SPEC 9700)
2.0070	Germany	DIN 1787	DIN CEN/TS 13388 (DIN SPEC 9700)
Cu-HCP	Europe	EN 13605
C10300	USA	UNS	Worldwide Guide to Equivalent Nonferrous Metals and Alloys, ASM International, 2001

Producer/Supplier/Trade names

Tradename	Supplier
CW021A	OTTO BRENSCHEIDT GmbH & Co. KG, Sundern
CW021A	Sundwiger Messingwerk GmbH & Co.KG, Hemer
K12	Wieland-Werke AG, Ulm
Wieland-K12	Wieland-Werke AG, Ulm

Material Compliance

REACh	RoHS
blur	blur

Cu-HCP (CW021A; DIN EN 13605 : 2021-07)

Linear-elastic

Temperature [°C]	Young's modulus [GPa]	Poisson's ratio
blur	blur	blur
blur	blur	blur

Yield strength

Temperature [°C]	0.2% Proof strength [MPa]
blur	blur

Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
blur	blur
blur	blur
blur	blur

Coefficient thermal expansion

Related Temperature [°C]	Temperature [°C]	Coefficient thermal expansion [10^-6*K^-1]
blur	blur	blur
blur	blur	blur
blur	blur	blur

Specific heat

Temperature [°C]	Specific heat [kJ/(kg*K)]
blur	blur
blur	blur
blur	blur

Density

Temperature [°C]	Density [g/cm³]
blur	blur

Tensile strength

Temperature [°C]	Tensile strength [MPa]
blur	blur

Thermal conductivity

Temperature [°C]	Thermal conductivity [W/(m*K)]
blur	blur

Classification

WIAM Material	Source description
blur	blur

Designation

Designation	Material number	Source
blur	blur	blur
blur	blur	blur
blur	blur	blur
blur	blur	blur
blur	blur	blur
blur	blur	blur
blur	blur	blur
blur	blur	blur
blur	blur	blur

Cu-HCP (soft annealed (+A); 4mm; not specified)

Strain life

Temperature [°C]	Cyclic fatigue strength coefficient [MPa]	Cyclic fatigue strength exponent	Ductility coefficient [Pa]	Ductility exponent	Cyclic strength coefficient [MPa]	Cyclic strain hardening exponent	Young's modulus [GPa]
blur	blur	blur	blur	blur	blur	blur	blur

Classification

Treatment	Dimension [mm]	Failure criteria	Source description
blur	blur	blur	blur

Cu-HCP (soft annealed (+A); 6.35mm; not specified)

Strain life

Temperature [°C]	Cyclic fatigue strength coefficient [MPa]	Cyclic fatigue strength exponent	Ductility coefficient [Pa]	Ductility exponent	Cyclic strength coefficient [MPa]	Cyclic strain hardening exponent	Young's modulus [GPa]
blur	blur	blur	blur	blur	blur	blur	blur

Classification

Treatment	Dimension [mm]	Failure criteria	Source description
blur	blur	blur	blur

Cu-HCP (drawn)

Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
blur	blur

Classification

Treatment	Source description
blur	blur

Cu-HCP (H035)

Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
blur	blur

Classification

Treatment	Source description
blur	blur

Cu-HCP (R200)

Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
blur	blur

Classification

Treatment	Source description
blur	blur

Cu-HCP (H065)

Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
blur	blur

Classification

Treatment	Source description
blur	blur

Cu-HCP (R240)

Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
blur	blur

Classification

Treatment	Source description
blur	blur

Cu-HCP (H080)

Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
blur	blur

Classification

Treatment	Source description
blur	blur

Cu-HCP (R280)

Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
blur	blur

Classification

Treatment	Source description
blur	blur

Cu-HCP (soft annealed (+A))

Linear-elastic

Temperature [°C]	Young's modulus [GPa]
blur	blur

Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
blur	blur
blur	blur
blur	blur

Classification

Treatment	Source description
blur	blur

Cu-HCP (soft annealed (+A); wire; 0.000-3.000mm)

Yield strength

Temperature [°C]	0.2% Proof strength [MPa]
blur	blur

Tensile strength

Temperature [°C]	Tensile strength [MPa]
blur	blur

Classification

Treatment	Semi-finished product	Dimension [mm]	Source description
blur	blur	blur	blur

Cu-HCP (soft annealed (+A); wire; 3.000-50.000mm)

Yield strength

Temperature [°C]	0.2% Proof strength [MPa]
blur	blur

Tensile strength

Temperature [°C]	Tensile strength [MPa]
blur	blur

Classification

Treatment	Semi-finished product	Dimension [mm]	Source description
blur	blur	blur	blur

Cu-HCP (R240; wire; 0.000-10.000mm)

Yield strength

Temperature [°C]	0.2% Proof strength [MPa]
blur	blur

Tensile strength

Temperature [°C]	Tensile strength [MPa]
blur	blur

Classification

Treatment	Semi-finished product	Dimension [mm]	Source description
blur	blur	blur	blur

Cu-HCP (R280; wire; 0.000-5.000mm)

Yield strength

Temperature [°C]	0.2% Proof strength [MPa]
blur	blur

Tensile strength

Temperature [°C]	Tensile strength [MPa]
blur	blur

Classification

Treatment	Semi-finished product	Dimension [mm]	Source description
blur	blur	blur	blur

Cu-HCP (cold formed)

Linear-elastic

Temperature [°C]	Young's modulus [GPa]
blur	blur

Classification

Treatment	Source description
blur	blur

Cu-HCP (soft annealed (+A); rod; 3.000mm)

Linear-elastic

Temperature [°C]	Young's modulus [GPa]
blur	blur
blur	blur
blur	blur
blur	blur
blur	blur
blur	blur

Classification

Treatment	Semi-finished product	Dimension [mm]	Source description
blur	blur	blur	blur

Cu-HCP | CW021A Material Datasheet

Material Test Series Values

Material Standard Values

Material Models for Simulation

Material Description

Chemical Composition

Mechanical Properties

Physical Properties

Young's Modulus [GPa] vs Temperature [°C]

Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] vs Temperature [°C]

Welding and Joining

Cross Reference

Producer/Supplier/Trade names

Material Compliance

Cu-HCP (CW021A; DIN EN 13605 : 2021-07)

Linear-elastic

Yield strength

Electrical resistivity

Coefficient thermal expansion

Specific heat

Density

Tensile strength

Thermal conductivity

Classification

Designation

Cu-HCP (soft annealed (+A); 4mm; not specified)

Strain life

Classification

Cu-HCP (soft annealed (+A); 6.35mm; not specified)

Strain life

Classification

Cu-HCP (drawn)

Electrical resistivity

Classification

Cu-HCP (H035)

Electrical resistivity

Classification

Cu-HCP (R200)

Electrical resistivity

Classification

Cu-HCP (H065)

Electrical resistivity

Classification

Cu-HCP (R240)

Electrical resistivity

Classification

Cu-HCP (H080)

Electrical resistivity

Classification

Cu-HCP (R280)

Electrical resistivity

Classification

Cu-HCP (soft annealed (+A))

Linear-elastic

Electrical resistivity

Classification

Cu-HCP (soft annealed (+A); wire; 0.000-3.000mm)

Yield strength

Tensile strength

Classification

Cu-HCP (soft annealed (+A); wire; 3.000-50.000mm)

Yield strength

Tensile strength

Classification

Cu-HCP (R240; wire; 0.000-10.000mm)

Yield strength

Tensile strength

Classification

Cu-HCP (R280; wire; 0.000-5.000mm)

Yield strength

Tensile strength

Classification

Cu-HCP (cold formed)

Linear-elastic

Classification

Cu-HCP (soft annealed (+A); rod; 3.000mm)

Linear-elastic

Classification

Similar Materials