Cu-ETP | CW004A Material Datasheet
Unlock Exclusive Materials Data
Gain access to a wealth of materials data by joining our Materials Portal.
Register for Free or Upgrade for Full AccessMaterial Description
Material Number | Material Number (single) | Standard | Range of Application | Standard Status | Country | Predecessor | Remark |
---|---|---|---|---|---|---|---|
CW004A (DIN EN 13605 : 2021-07) | CW004A | DIN EN 13605 : 2021-07 | Supersedes DIN EN 13605 : 2013-09 | Valid | Germany | Cu-ETP | Copper profiles and profiled wire for electrical purposes. Tough pitch copper (oxygencontaining coppers) of this type are produced with a controlled amount of oxygen and have high electrical conductivity. Special precautions are necessary when heat-treating, welding or brazing these coppers in atmospheres containing hydrogen to avoid hydrogen embrittlement. |
Chemical Composition
Bi [%] | Cu [%] | O [%] | Pb [%] | Source | Remark |
---|---|---|---|---|---|
blur | blur | blur | blur | blur | blur |
Mechanical Properties
Semi-finished Product | Condition | Strength Abbrevation | Nominal Size [mm] | Temperature [°C] | Tensile Strength [MPa] | Yield Strength (0.2% offset) [MPa] | Elongation A100 [%] | Elongation A [%] | Hardness HB | HBW | Hardness HV | Source |
---|---|---|---|---|---|---|---|---|---|---|---|
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
Physical Properties
Condition | Strength Abbrevation | Temperature [°C] | Melting Temperature [°C] | Density [g/cm³] | Young's Modulus [GPa] | Poisson's Ratio | Mean Coefficient of Thermal Expansion [10^-6*K^-1] | Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] | Thermal Conductivity [W/(m*K)] | Specific Electrical Resistance [µΩm] | Mean Specific Heat Capacity [kJ/(kg*K)] | Electric Conductivity [MS/m] | Specific Mass Resistance [Ωg/m²] | Specific Electric Conductivity [% IACS] | Source |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur | blur |
Young's Modulus [GPa] vs Temperature [°C]
Exclusive Insight Locked!
This premium diagram is currently blurred. Gain full access to detailed insights and stay ahead with exclusive content.
Unlock NowMean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] vs Temperature [°C]
Exclusive Insight Locked!
This premium diagram is currently blurred. Gain full access to detailed insights and stay ahead with exclusive content.
Unlock NowWelding and Joining
Procedure | Welding and Joining - Evaluation | Source |
---|---|---|
blur | blur | blur |
blur | blur | blur |
Cross Reference
Material Name | Country | Standard | Source |
---|---|---|---|
T2 | China | GB 3109 | Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf |
T2 | China | GB/T 4423 | Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf |
T2 | China | GB/T5231 | Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf |
Cu-ETP | Europe | EN 13601 | |
C101 | Great Britain | BS 1432 | Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf |
C101 | Great Britain | BS 1433 | Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf |
WRB/C | Japan | JIS C 3106 | Worldwide Guide to Equivalent Nonferrous Metals and Alloys, ASM International, 2001 |
M0 | Russia | GOST 859 | Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf |
B49 UNS C11000 | USA | ASTM B49 | Worldwide Guide to Equivalent Nonferrous Metals and Alloys, ASM International, 2001 |
B187 UNS C11000 | USA | ASTM B187 | Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf |
C11000 | USA | UNS | Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf |
E-Cu58 | Germany | DIN 1787 | DIN CEN/TS 13388 (DIN SPEC 9700) |
2.0065 | Germany | DIN 1787 | DIN CEN/TS 13388 (DIN SPEC 9700) |
Producer/Supplier/Trade names
Tradename | Supplier |
---|---|
K32 | Wieland-Werke AG, Ulm |
Wieland-K32 | Wieland-Werke AG, Ulm |
CW004A | KME Germany AG & Co.KG, Osnabrück |
Material Compliance
REACh | RoHS |
---|---|
blur | blur |
Cu-ETP (CW004A; DIN EN 13605 : 2021-07)
Linear-elastic
Temperature [°C] | Young's modulus [GPa] | Poisson's ratio |
---|---|---|
blur | blur | blur |
blur | blur | blur |
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
---|---|
blur | blur |
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
blur | blur |
blur | blur |
blur | blur |
blur | blur |
blur | blur |
Coefficient thermal expansion
Related Temperature [°C] | Temperature [°C] | Coefficient thermal expansion [10^-6*K^-1] |
---|---|---|
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
Specific heat
Temperature [°C] | Specific heat [kJ/(kg*K)] |
---|---|
blur | blur |
blur | blur |
blur | blur |
blur | blur |
Density
Temperature [°C] | Density [g/cm³] |
---|---|
blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
---|---|
blur | blur |
Thermal conductivity
Temperature [°C] | Thermal conductivity [W/(m*K)] |
---|---|
blur | blur |
blur | blur |
blur | blur |
blur | blur |
blur | blur |
blur | blur |
blur | blur |
Classification
WIAM Material | Source description |
---|---|
blur | blur |
Designation
Designation | Material number | Source |
---|---|---|
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
blur | blur | blur |
Cu-ETP (soft annealed (+A); 4mm; not specified)
Strain life
Temperature [°C] | Cyclic fatigue strength coefficient [MPa] | Cyclic fatigue strength exponent | Ductility coefficient [Pa] | Ductility exponent | Cyclic strength coefficient [MPa] | Cyclic strain hardening exponent | Young's modulus [GPa] |
---|---|---|---|---|---|---|---|
blur | blur | blur | blur | blur | blur | blur | blur |
Classification
Treatment | Dimension [mm] | Failure criteria | Source description |
---|---|---|---|
blur | blur | blur | blur |
Cu-ETP (soft annealed (+A); 6.35mm; not specified)
Strain life
Temperature [°C] | Cyclic fatigue strength coefficient [MPa] | Cyclic fatigue strength exponent | Ductility coefficient [Pa] | Ductility exponent | Cyclic strength coefficient [MPa] | Cyclic strain hardening exponent | Young's modulus [GPa] |
---|---|---|---|---|---|---|---|
blur | blur | blur | blur | blur | blur | blur | blur |
Classification
Treatment | Dimension [mm] | Failure criteria | Source description |
---|---|---|---|
blur | blur | blur | blur |
Cu-ETP (drawn)
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
Classification
Treatment | Source description |
---|---|
blur | blur |
Cu-ETP (H035)
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
Classification
Treatment | Source description |
---|---|
blur | blur |
Cu-ETP (R200)
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
Classification
Treatment | Source description |
---|---|
blur | blur |
Cu-ETP (H065)
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
Classification
Treatment | Source description |
---|---|
blur | blur |
Cu-ETP (R240)
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
Classification
Treatment | Source description |
---|---|
blur | blur |
Cu-ETP (H080)
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
Classification
Treatment | Source description |
---|---|
blur | blur |
Cu-ETP (R280)
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
Classification
Treatment | Source description |
---|---|
blur | blur |
Cu-ETP (soft annealed (+A))
Linear-elastic
Temperature [°C] | Young's modulus [GPa] |
---|---|
blur | blur |
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
blur | blur |
blur | blur |
blur | blur |
blur | blur |
blur | blur |
Classification
Treatment | Source description |
---|---|
blur | blur |
Cu-ETP (cold formed)
Linear-elastic
Temperature [°C] | Young's modulus [GPa] |
---|---|
blur | blur |
blur | blur |
blur | blur |
blur | blur |
Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
---|---|
blur | blur |
Classification
Treatment | Source description |
---|---|
blur | blur |
Cu-ETP (soft annealed (+A); wire; 0.000-3.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
---|---|
blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
---|---|
blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
---|---|---|---|
blur | blur | blur | blur |
Cu-ETP (soft annealed (+A); wire; 3.000-50.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
---|---|
blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
---|---|
blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
---|---|---|---|
blur | blur | blur | blur |
Cu-ETP (R240; wire; 0.000-10.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
---|---|
blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
---|---|
blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
---|---|---|---|
blur | blur | blur | blur |
Cu-ETP (R280; wire; 0.000-5.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
---|---|
blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
---|---|
blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
---|---|---|---|
blur | blur | blur | blur |