Cu-ETP | CW004A Material Datasheet

Material Test Series Values

Material Standard Values

Material Models for Simulation

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Material Description

Material Number	Material Number (single)	Standard	Range of Application	Standard Status	Country	Predecessor	Successor	Remark
CW004A (DIN EN 12165 : 2011-08)	CW004A	DIN EN 12165 : 2011-08	DIN EN 12165 : 2011-08 replaced by DIN EN 12165 : 2016-11	Replaced	Germany	Cu-ETP	Cu-ETP	Cu-ETP, mat. No CW004A, is an oxygenous copper with Cu >= 99,9%. The most excellent material property is its high thermal and electrical conductivity. Tensile strength and Brinell hardness are increasable by cold forming. The material does not show any embrittlement at low temperatures and has a high corrosion resistance particularly to drinking and industrial water. It is not hydrogen resistant. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: good soft soldering: very good gas-shielded welding: moderately burnishing: very good Application: Due to the very high conductivity use in electrical engineering, electronics application. Furthermore in food and beverage industry, refrigeration and air-condition technology, in machine, ship, apparatus and vehicle engineering, in household as well as for hardware, in handcraft and in construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Chemical Composition

Bi [%]	Cu [%]	O [%]	Pb [%]	Source	Remark
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Mechanical Properties

Semi-finished Product	Condition	Strength Abbrevation	Nominal Size [mm]	Temperature [°C]	Tensile Strength [MPa]	Yield Strength (0.2% offset) [MPa]	Elongation A [%]	Reduction of Area [%]	Hardness HB \| HBW	Source
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Physical Properties

Condition	Temperature [°C]	Melting Temperature [°C]	Density [g/cm³]	Young's Modulus [GPa]	Poisson's Ratio	Mean Coefficient of Thermal Expansion [10^-6*K^-1]	Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1]	Thermal Conductivity [W/(m*K)]	Specific Electrical Resistance [µΩm]	Mean Specific Heat Capacity [kJ/(kg*K)]	Electric Conductivity [MS/m]	Specific Electric Conductivity [% IACS]	Source
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Young's Modulus [GPa] vs Temperature [°C]

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Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] vs Temperature [°C]

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Creep Rupture Behaviour

Condition	Temperature [°C]	Creep Tensile Strength at 10² h [MPa]	Creep Tensile Strength at 10³ h [MPa]	Creep Tensile Strength at 10^4 h [MPa]	Source
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Heat Treatment

Heat Treatment	Temperature [°C]	Source	Remark
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Cross Reference

Material Name	Country	Standard	Source
ETP	Australia	AS 1568	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
ETP	Australia	AS/NZS 1567	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
110	Australia	AS 1568	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
110	Australia	AS/NZS 1567	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
T2	China	GB/T 5231	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
T2	China	GB/T 4423	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
Cu-ETP	Europe	EN 12165	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
Cu-ETP	International	ISO 1337	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
M0	Russia	GOST 859	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
C11000	USA	UNS	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
B124 UNS C11000	USA	ASTM B124	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
B152 UNS C11000	USA	ASTM B152	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
B187 UNS C11000	USA	ASTM B187	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
B283 UNS C11000	USA	ASTM B283	Deutsches Kupferinstitut Berufsverband e.V., Düsseldorf
E-Cu58	Germany	DIN 1787	DIN CEN/TS 13388 (DIN SPEC 9700)
2.0065	Germany	DIN 1787	DIN CEN/TS 13388 (DIN SPEC 9700)

Producer/Supplier/Trade names

Tradename	Supplier
211	William Prym Holding GmbH, Stolberg
3010	VDM Metals GmbH, Frankfurt/Main
E-Cu	F. Hackländer GmbH, Kassel
E-Cu	Heraeus Deutschland GmbH & Co. KG, Hanau
E-Cu58	CSN Carl Schreiber GmbH, Neunkirchen
E-Cu58	Wieland-Werke AG, Velbert
E-Cu58	KME Germany AG & Co.KG, Osnabrück
E-Cu58	Deutsche Giessdraht GmbH, Emmerich
E-Cu58	Wieland Prometa GmbH, Düsseldorf
E-Cu58	LEONI Draht GmbH, Weißenburg
E-Kupfer	VDM Metals GmbH, Frankfurt/Main

Material Compliance

REACh	RoHS
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Cu-ETP (CW004A; DIN EN 12165 : 2011-08)

Linear-elastic

Temperature [°C]	Young's modulus [GPa]	Poisson's ratio
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Yield strength

Temperature [°C]	0.2% Proof strength [MPa]
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Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
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Coefficient thermal expansion

Related Temperature [°C]	Temperature [°C]	Coefficient thermal expansion [10^-6*K^-1]
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Specific heat

Temperature [°C]	Specific heat [kJ/(kg*K)]
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Density

Temperature [°C]	Density [g/cm³]
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Tensile strength

Temperature [°C]	Tensile strength [MPa]
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Thermal conductivity

Temperature [°C]	Thermal conductivity [W/(m*K)]
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Classification

WIAM Material	Source description
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Designation

Designation	Material number	Source
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Cu-ETP (soft annealed (+A); 4mm; not specified)

Strain life

Temperature [°C]	Cyclic fatigue strength coefficient [MPa]	Cyclic fatigue strength exponent	Ductility coefficient [Pa]	Ductility exponent	Cyclic strength coefficient [MPa]	Cyclic strain hardening exponent	Young's modulus [GPa]
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Classification

Treatment	Dimension [mm]	Failure criteria	Source description
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Cu-ETP (soft annealed (+A); 6.35mm; not specified)

Strain life

Temperature [°C]	Cyclic fatigue strength coefficient [MPa]	Cyclic fatigue strength exponent	Ductility coefficient [Pa]	Ductility exponent	Cyclic strength coefficient [MPa]	Cyclic strain hardening exponent	Young's modulus [GPa]
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Classification

Treatment	Dimension [mm]	Failure criteria	Source description
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Cu-ETP (soft annealed (+A))

Linear-elastic

Temperature [°C]	Young's modulus [GPa]
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Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
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Classification

Treatment	Source description
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Cu-ETP (cold formed)

Linear-elastic

Temperature [°C]	Young's modulus [GPa]
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Electrical resistivity

Temperature [°C]	Specific electrical resistance [µΩm]
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Classification

Treatment	Source description
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Cu-ETP (extruded)

Yield strength

Temperature [°C]	0.2% Proof strength [MPa]
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Tensile strength

Temperature [°C]	Tensile strength [MPa]
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Classification

Treatment	Source description
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Cu-ETP | CW004A Material Datasheet

Material Test Series Values

Material Standard Values

Material Models for Simulation

Material Description

Chemical Composition

Mechanical Properties

Physical Properties

Young's Modulus [GPa] vs Temperature [°C]

Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] vs Temperature [°C]

Creep Rupture Behaviour

Heat Treatment

Cross Reference

Producer/Supplier/Trade names

Material Compliance

Cu-ETP (CW004A; DIN EN 12165 : 2011-08)

Linear-elastic

Yield strength

Electrical resistivity

Coefficient thermal expansion

Specific heat

Density

Tensile strength

Thermal conductivity

Classification

Designation

Cu-ETP (soft annealed (+A); 4mm; not specified)

Strain life

Classification

Cu-ETP (soft annealed (+A); 6.35mm; not specified)

Strain life

Classification

Cu-ETP (soft annealed (+A))

Linear-elastic

Electrical resistivity

Classification

Cu-ETP (cold formed)

Linear-elastic

Electrical resistivity

Classification

Cu-ETP (extruded)

Yield strength

Tensile strength

Classification

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