PdAg50 Material Datasheet
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| Material Number | Material Name | Standard Status | VDA 231-106 classification | |
|---|---|---|---|---|
| PdAg50 | PdAg50 | Valid | 4.1 | 1) |
| 1) Remark: The palladium-silver alloy PdAg50, also Pd50Ag50 or 50Pd50Ag, is used as contact material in relays and switches of the telecommunications as well as of the measuring and control technology with voltages in the range 20 to 60 V and switching capacities up to approx. Furthermore, the material is used as Potentiometerlegierung. The material is ductile, corrosion-resistant, less resistant to Pd (pure) Brown Powder effect, abrasion resistant. It is non-cutting and machinable machinable, roll-clad, from the gas phase conditionally separable. |
Chemical Composition
| Ag [%] | Pd [%] | |
|---|---|---|
| blur | blur | 1) |
| 1) Source: blur |
Material Compliance
| REACh | RoHS |
|---|---|
| blur | blur |
Mechanical Properties
| Condition | Temperature [°C] | Tensile Strength [MPa] | Yield Strength (0.2% offset) [MPa] | Elongation A [%] | Hardness HV | |
|---|---|---|---|---|---|---|
| blur | blur | blur | blur | blur | blur | 1) |
| blur | blur | blur | blur | blur | blur | 1) |
| 1) Source: blur |
Physical Properties
| Condition | Temperature [°C] | Melting Temperature [°C] | Density [g/cm³] | Young's Modulus [GPa] | Shear Modulus [GPa] | Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] | Thermal Conductivity [W/(m*K)] | Specific Electrical Resistance [µΩm] | |
|---|---|---|---|---|---|---|---|---|---|
| blur | 1) | ||||||||
| blur | blur | blur | blur | blur | blur | blur | 1) | ||
| blur | blur | blur | blur | blur | blur | blur | 1) | ||
| blur | blur | 1) | |||||||
| 1) Source: blur |
Cross Reference
| Material Name |
|---|
| Pd50Ag50 |
| 50Pd50Ag |
Producer/Supplier/Trade names
| Tradename | Supplier |
|---|---|
| PdAg50 | Evonik-Degussa GmbH, Essen |
Classification
| WIAM Material | Treatment | Semi-finished product | Dimension [mm] | Load type | Failure criteria | Rolling direction | Maximum stress [MPa] | Strain at maximum stress [%] | Source description |
|---|---|---|---|---|---|---|---|---|---|
| blur | blur |
Density
| Temperature [°C] | Density [g/cm³] |
|---|---|
| blur | blur |
Linear-elastic
| Temperature [°C] | Young's modulus [GPa] | Bulk modulus [GPa] | Shear modulus [GPa] | Poisson's ratio |
|---|---|---|---|---|
| blur | blur | |||
| blur | blur |
Yield strength
| Temperature [°C] | 0.1% Proof strength [MPa] | 0.2% Proof strength [MPa] | Yield strength [MPa] |
|---|---|---|---|
| blur | blur |
Tensile strength
| Temperature [°C] | Tensile strength [MPa] |
|---|---|
| blur | blur |
Coefficient thermal expansion
| Related Temperature [°C] | Temperature [°C] | Coefficient thermal expansion [10^-6*K^-1] |
|---|---|---|
| blur | blur | blur |
Thermal conductivity
| Temperature [°C] | Thermal conductivity [W/(m*K)] |
|---|---|
| blur | blur |
Electrical resistivity
| Temperature [°C] | Specific electrical resistance [µΩm] |
|---|---|
| blur | blur |
Designation
| Designation | Material number | Source |
|---|---|---|
| blur | blur | |
| blur | ||
| blur | ||
| blur | blur |
Classification
| WIAM Material | Treatment | Semi-finished product | Dimension [mm] | Load type | Failure criteria | Rolling direction | Maximum stress [MPa] | Strain at maximum stress [%] | Source description |
|---|---|---|---|---|---|---|---|---|---|
| blur | blur |
Density
| Temperature [°C] | Density [g/cm³] |
|---|---|
| blur | blur |
Linear-elastic
| Temperature [°C] | Young's modulus [GPa] | Bulk modulus [GPa] | Shear modulus [GPa] | Poisson's ratio |
|---|---|---|---|---|
| blur | blur | |||
| blur | blur |
Yield strength
| Temperature [°C] | 0.1% Proof strength [MPa] | 0.2% Proof strength [MPa] | Yield strength [MPa] |
|---|---|---|---|
| blur | blur |
Tensile strength
| Temperature [°C] | Tensile strength [MPa] |
|---|---|
| blur | blur |
Thermal conductivity
| Temperature [°C] | Thermal conductivity [W/(m*K)] |
|---|---|
| blur | blur |
Electrical resistivity
| Temperature [°C] | Specific electrical resistance [µΩm] |
|---|---|
| blur | blur |
Classification
| WIAM Material | Treatment | Semi-finished product | Dimension [mm] | Load type | Failure criteria | Rolling direction | Maximum stress [MPa] | Strain at maximum stress [%] | Source description |
|---|---|---|---|---|---|---|---|---|---|
| blur | blur |
Density
| Temperature [°C] | Density [g/cm³] |
|---|---|
| blur | blur |
Linear-elastic
| Temperature [°C] | Young's modulus [GPa] | Bulk modulus [GPa] | Shear modulus [GPa] | Poisson's ratio |
|---|---|---|---|---|
| blur | blur | |||
| blur | blur |
Yield strength
| Temperature [°C] | 0.1% Proof strength [MPa] | 0.2% Proof strength [MPa] | Yield strength [MPa] |
|---|---|---|---|
| blur | blur |
Tensile strength
| Temperature [°C] | Tensile strength [MPa] |
|---|---|
| blur | blur |
Thermal conductivity
| Temperature [°C] | Thermal conductivity [W/(m*K)] |
|---|---|
| blur | blur |
Electrical resistivity
| Temperature [°C] | Specific electrical resistance [µΩm] |
|---|---|
| blur | blur |