CuMg0,7 | 2.1323 Material Datasheet
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| Material Number | Material Name | Material Number (single) | Standard | Standard Status | Country | VDA 231-106 classification | |
|---|---|---|---|---|---|---|---|
| 2.1323 (DIN 17666 : 1983-12) | CuMg0,7 | 2.1323 | DIN 17666 : 1983-12 | Withdrawn without replacement | Germany | 3.2 | 1) |
| 1) Remark: CuMg0,7 belongs to the low-alloy, not-hardening copper alloys. A strength increasing can be reached only by cold working. In relation to copper CuMg alloys have higher strength when static and dynamic stress also at increased temperature as well as a better wear characteristics. The conductivity of the pure copper is however reduced by the addition of Mg. The destabilization temperature is approx. 350 °C. Manufacturing properties: warm forming: well cold forming: very well machinability: means hard and soft soldering: well gas-schielded arc welding: well polishing bar: very well Application: CuMg0,7 corresponds to the bronze III according to DIN 48300 Draehte for Leitungsseile. Main application are energized overhead lines of large span and contact wires. |
Chemical Composition
| Mg [%] | Remainder | |
|---|---|---|
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Material Compliance
| REACh | RoHS |
|---|---|
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Physical Properties
| Temperature [°C] | Melting Temperature [°C] | Density [g/cm³] | Young's Modulus [GPa] | Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] | Thermal Conductivity [W/(m*K)] | Electric Conductivity [MS/m] | |
|---|---|---|---|---|---|---|---|
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Classification
| WIAM Material | Treatment | Semi-finished product | Dimension [mm] | Load type | Failure criteria | Rolling direction | Maximum stress [MPa] | Strain at maximum stress [%] | Source description |
|---|---|---|---|---|---|---|---|---|---|
| blur | blur |
Density
| Temperature [°C] | Density [g/cm³] |
|---|---|
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Linear-elastic
| Temperature [°C] | Young's modulus [GPa] | Bulk modulus [GPa] | Shear modulus [GPa] | Poisson's ratio |
|---|---|---|---|---|
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Coefficient thermal expansion
| Related Temperature [°C] | Temperature [°C] | Coefficient thermal expansion [10^-6*K^-1] |
|---|---|---|
| blur | blur | blur |
Thermal conductivity
| Temperature [°C] | Thermal conductivity [W/(m*K)] |
|---|---|
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Designation
| Designation | Material number | Source |
|---|---|---|
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