AuSi2 Material Datasheet
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| Material Number | Material Name | Standard Status | VDA 231-106 classification | |
|---|---|---|---|---|
| AuSi2 | AuSi2 | Valid | 4.2 | 1) |
| 1) Remark: Gold-based solder alloy. Soft solders are characterized by a liquidus temperature <450°C. High precious metal-containing special soft solders are always used when the properties of the classic SnPb soft solders do not meet the desired requirements. This is the case in different areas of electronics and microelectronics. The gold base special soft solders are characterized by considerable strength values. At the same time, these materials have almost negligible plastic elongation. AuSi (1... 3%) is an introduced material for soldering Si semiconductor chips to the substrate (copper or metallized ceramics). With the special solder material AuSi3, connections of the highest stability and temperature cycle stability are achieved when soldering the Si chips to the system carrier or housing. |
Chemical Composition
| Au [%] | Si [%] | |
|---|---|---|
| blur | blur | 1) |
| 1) Source: blur |
Material Compliance
| REACh | RoHS |
|---|---|
| blur | blur |
Mechanical Properties
| Condition | Temperature [°C] | Yield Strength [MPa] | Elongation A [%] | |
|---|---|---|---|---|
| blur | blur | blur | blur | 1) |
| 1) Source: blur |
Physical Properties
| Temperature [°C] | Melting Temperature [°C] | Density [g/cm³] | Thermal Conductivity [W/(m*K)] | Specific Electrical Resistance [µΩm] | Electric Conductivity [MS/m] | |
|---|---|---|---|---|---|---|
| blur | 1) | |||||
| blur | blur | blur | blur | blur | 1) | |
| 1) Source: blur |
Producer/Supplier/Trade names
| Tradename | Supplier |
|---|---|
| AuSi2 | Evonik-Degussa GmbH, Essen |