CuSi3Mn | 2.1525 Material Datasheet
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| Material Number | Material Number (single) | Standard | Scope | Standard Status | Country | VDA 231-106 classification | |
|---|---|---|---|---|---|---|---|
| 2.1525 (DIN 17666 : 1970-11) | 2.1525 | DIN 17666 : 1970-11 | DIN 17666 : 1970-11 replaced by DIN 17666 : 1983-12 | Replaced | Germany | 3.2 | 1) |
| 1) Remark: CuSi3Mn belongs to the low-alloy, not-hardenable copper alloys. The physical properties pure copper are substantially improved by additive of silicon. CuSiMn alloys can be solidified by cold forming more strongly than copper. Strength grade lie between F35 and F60. The electrical conductivity is smaller, the corrosion resistance is better than those of the unalloyed copper. Manufacturing properties: warm forming: well cold forming: very well machinability: badly braze welding: well soft soldering: means gas-schielded arc welding: very well polishing bar: well Application: The material is outstanding suitable because of the good weldability and corrosion resistance for the apparatus engineering. Use for heat-transfer parts and condenser plates, container, pin and nuts, for flanges as well as for soils. |
Chemical Composition
| Cu [%] | Mn [%] | Si [%] | |
|---|---|---|---|
| blur | blur | blur | 1) |
| 1) Source: blur |
Physical Properties
| Temperature [°C] | Melting Temperature [°C] | Density [g/cm³] | Young's Modulus [GPa] | Thermal Conductivity [W/(m*K)] | Electric Conductivity [MS/m] | |
|---|---|---|---|---|---|---|
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Cross Reference
| Material Name | Country | Standard |
|---|---|---|
| CuSi3Mn1 | International | ISO 1187-83 |
Producer/Supplier/Trade names
| Tradename | Supplier |
|---|---|
| CuSi3Mn | CSN Carl Schreiber GmbH, Neunkirchen |
| CuSi3Mn | Schreier Metall GmbH, Erkrath |
| CuSi3Mn | Wieland Metal Services Germany GmbH, Düsseldorf |
Material Compliance
| REACh | RoHS |
|---|---|
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Linear-elastic
| Temperature [°C] | Young's modulus [GPa] | Bulk modulus [GPa] | Shear modulus [GPa] | Poisson's ratio |
|---|---|---|---|---|
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Density
| Temperature [°C] | Density [g/cm³] |
|---|---|
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Thermal conductivity
| Temperature [°C] | Thermal conductivity [W/(m*K)] |
|---|---|
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Classification
| WIAM Material | Treatment | Semi-finished product | Dimension [mm] | Load type | Failure criteria | Rolling direction | Maximum stress [MPa] | Strain at maximum stress [%] | Source description |
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Designation
| Designation | Material number | Source |
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